August 16, 2026 article Positive-type photosensitive polyimides for advanced microelectronic packaging: from molecular design to patterning and device reliability Chemical Engineering Journal DOI: 10.1016/j.cej.2026.180690 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 0 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Towards Long-Term Stable Polyimide-Based Flexible Electrical Insulation for Chronically Implanted Neural Electrodes 2021 Micromachines article Neuroscience Neuroscience and Neural Engineering Open access 29 citations 1 result