Technology Roadmap of Bioinspired Computing Hardware
ACS Nano, vol. 20, pp. 8102–8163
Abstract
The rapid growth of artificial intelligence (AI) is increasingly constrained by fundamental hardware bottlenecks in computation throughput and energy efficiency. Bioinspired computing (BIC) offers a promising alternative by emulating the intrinsic advantages of biological systems, such as parallelism, adaptability, and robustness. Progress in BIC hardware demands interdisciplinary convergence that bridges materials science and device physics with neuroscience, computer science, mathematics, and information science. Therefore, the development of this cross-disciplinary field urgently requires a comprehensive roadmap that analyzes systematically and in-depth the frontier issues and the latest progress. In this roadmap, we categorize the critical challenges into three components: hardware foundations, architectures, and prototype realizations. We highlight how biological features inspire the design of BIC hardware through device physics and discuss their performance metrics and engineering challenges. We then describe how diverse signaling rules and structural organizations in BIC architectures support specific computational prototypes, including electronic and photonic BIC chips, and present a technological roadmap that outlines opportunities to expand the functional scope of BIC hardware through coordinated advances in devices, architectures, and system demonstrations. This ongoing convergence of interdisciplinary knowledge can help accelerate the shift toward high-efficiency AI hardware.
Authors 73
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Hong Kong Polytechnic University · University of Hong Kong
Affiliation as printed
Centre for Advanced Semiconductors and Integrated Circuits
Department of Applied Physics
Department of Electrical and Electronic Engineering
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
The University of Hong Kong
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Hong Kong Polytechnic University
Affiliation as printed
Department of Applied Physics
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
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Hong Kong Polytechnic University
Affiliation as printed
Department of Applied Physics
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
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Hong Kong Polytechnic University
Affiliation as printed
Department of Applied Physics
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
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Hong Kong Polytechnic University
Affiliation as printed
Department of Applied Physics
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
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National University of Singapore
Affiliation as printed
Department of Electrical and Computer Engineering
National University of Singapore
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Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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Paul Scherrer Institute · ETH Zurich
Affiliation as printed
ETH Zürich
Laboratory for Battery Science, PSI Center for Energy and Environmental Sciences
Laboratory for Inorganic Chemistry, Department of Chemistry and Applied Biosciences
Paul Scherrer Institute
-
Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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Eindhoven University of Technology
Affiliation as printed
Department of Mechanical Engineering
Eindhoven University of Technology
Institute for Complex Molecular Systems
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The Hong Kong University of Science and Technology (Guangzhou)
Affiliation as printed
Microelectronics Thrust
The Hong Kong University of Science and Technology (Guangzhou)
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University of California, Berkeley
Affiliation as printed
Department of Electrical Engineering and Computer Sciences
University of California, Berkeley
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Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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State Key Laboratory of Millimeter Waves · Southeast University
Affiliation as printed
Southeast University
State Key Laboratory of Millimeter Waves
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Affiliation as printed
Engineering Science and Mechanics
The Pennsylvania State University
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Technische Universität Dresden
Affiliation as printed
Institut für Grundlagen der Elektrotechnik und Elektronik
Technische Universität Dresden
-
Affiliation as printed
Department of Applied Physics, Aalto University School of Science, P.O. Box 15100, Aalto FI-00076, Finland
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Beijing National Research Center for Information Science and Technology · Tsinghua University
Affiliation as printed
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist
Tsinghua University
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Affiliation as printed
Department of Electronic Engineering
Tsinghua University
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Affiliation as printed
Dipartimento di Elettronica, Informazione e Bioingegneria
Politecnico di Milano and IU.NET
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State Key Laboratory of Millimeter Waves · Southeast University
Affiliation as printed
Southeast University
State Key Laboratory of Millimeter Waves
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Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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Affiliation as printed
Department of Electronics and Telecommunications
Politecnico di Torino
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Indian Institute of Science Bangalore
Affiliation as printed
Centre for Nanoscience and Engineering
Indian Institute of Science
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Huazhong University of Science and Technology
Affiliation as printed
Huazhong University of Science and Technology
School of Integrated Circuits
Shenzhen Loop Area Institute
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Chinese University of Hong Kong
Affiliation as printed
Department of Electronic Engineering
The Chinese University of Hong Kong
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Affiliation as printed
Peking University
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits
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Affiliation as printed
Department of Materials Science and Engineering, and Inter-University Semiconductor Research Center, College of Engineering
Seoul National University
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Affiliation as printed
Dipartimento di Elettronica, Informazione e Bioingegneria
Politecnico di Milano and IU.NET
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Affiliation as printed
Department of Materials Science and Engineering, College of Engineering
Yonsei University
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Affiliation as printed
School of Physics and Sydney Nano Institute
University of Sydney
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AMO (Germany) · RWTH Aachen University
Affiliation as printed
AMO GmbH
Chair of Electronic Devices
RWTH Aachen University
-
Affiliation as printed
Centre for Advanced Semiconductors and Integrated Circuits
Department of Electrical and Electronic Engineering
The University of Hong Kong
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Collaborative Innovation Center of Advanced Microstructures · National Laboratory of Solid State Microstructures · Nanjing University
Affiliation as printed
Chemistry and Biomedicine Innovation Center
Institute of Brain-Inspired Intelligence, National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures
Nanjing University
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Peking University · Key Laboratory of Guangdong Province
Affiliation as printed
Guangdong Provincial Key Laboratory of In-Memory Computing Chips, School of Electronic and Computer Engineering, Shenzhen Graduate School
Peking University
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits
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Chinese University of Hong Kong
Affiliation as printed
Department of Electronic Engineering
The Chinese University of Hong Kong
-
Affiliation as printed
Peking University
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits
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State Key Laboratory of Millimeter Waves · Southeast University
Affiliation as printed
Southeast University
State Key Laboratory of Millimeter Waves
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Affiliation as printed
Graz University of Technology
Institute of Machine Learning and Neural Computation
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Affiliation as printed
Dipartimento di Elettronica, Informazione e Bioingegneria
Politecnico di Milano and IU.NET
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Technische Universität Dresden
Affiliation as printed
Institut für Grundlagen der Elektrotechnik und Elektronik
Technische Universität Dresden
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Collaborative Innovation Center of Advanced Microstructures · National Laboratory of Solid State Microstructures · Nanjing University
Affiliation as printed
Institute of Brain-Inspired Intelligence, National Laboratory of Solid State Microstructures, School of Physics, Collaborative Innovation Center of Advanced Microstructures
Nanjing University
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NaMLab (Germany) · Technische Universität Dresden
Affiliation as printed
Institut für Halbleiter- und Mikrosystemtechnik
NaMLab gGmbH
Technische Universität Dresden
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Technische Universität Dresden
Affiliation as printed
Institut für Grundlagen der Elektrotechnik und Elektronik
Technische Universität Dresden
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Paul Scherrer Institute · ETH Zurich
Affiliation as printed
ETH Zürich
Laboratory for Battery Science, PSI Center for Energy and Environmental Sciences
Laboratory for Inorganic Chemistry, Department of Chemistry and Applied Biosciences
Paul Scherrer Institute
-
Affiliation as printed
Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering
University of Edinburgh
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Technische Universität Dresden
Affiliation as printed
Institut für Grundlagen der Elektrotechnik und Elektronik
Technische Universität Dresden
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Hong Kong University of Science and Technology
Affiliation as printed
AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, New Territories 999077, China
Department of Electronics and Computer Engineering
Department of Physics
The Hong Kong University of Science and Technology
-
Affiliation as printed
NaMLab gGmbH
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John Paul Strachan Aachen
Forschungszentrum Jülich · RWTH Aachen University
Affiliation as printed
Forschungszentrum Jülich GmbH
Peter Grünberg Institute 14
RWTH Aachen University
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Max Planck Institute for Polymer Research
Affiliation as printed
Max Planck Institute for Polymer Research
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Beijing National Research Center for Information Science and Technology · Tsinghua University
Affiliation as printed
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist
Tsinghua University
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Technische Universität Dresden
Affiliation as printed
Institut für Grundlagen der Elektrotechnik und Elektronik
Technische Universität Dresden
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Eindhoven University of Technology
Affiliation as printed
Department of Mechanical Engineering
Eindhoven University of Technology
Institute for Complex Molecular Systems
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Forschungszentrum Jülich · Bulgarian Academy of Sciences · Institute of Electrochemistry and Energy Systems
Affiliation as printed
Bulgarian Academy of Sciences
Forschungszentrum Jülich
Institute of Electrochemistry and Energy Systems
Peter Grünberg Institute 7 and JARA-FIT
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Eindhoven University of Technology
Affiliation as printed
Department of Mechanical Engineering
Eindhoven University of Technology
Institute for Complex Molecular Systems
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Chinese University of Hong Kong
Affiliation as printed
Department of Electronic Engineering
The Chinese University of Hong Kong
-
Affiliation as printed
Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials
Xi’an Jiaotong University
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Hong Kong Polytechnic University · University of Hong Kong
Affiliation as printed
Centre for Advanced Semiconductors and Integrated Circuits
Department of Applied Physics
Department of Electrical and Electronic Engineering
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
The University of Hong Kong
-
Affiliation as printed
Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials
Xi’an Jiaotong University
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Huazhong University of Science and Technology
Affiliation as printed
Huazhong University of Science and Technology
School of Integrated Circuits
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Beijing National Research Center for Information Science and Technology · Tsinghua University
Affiliation as printed
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, BNRist
Tsinghua University
-
Affiliation as printed
Department of Electrical and Computer Engineering
University of Massachusetts
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Southern University of Science and Technology
Affiliation as printed
Department of Biomedical Engineering
Southern University of Science and Technology
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Hong Kong University of Science and Technology
Affiliation as printed
AI Chip Center for Emerging Smart Systems, Hong Kong Science Park, Hong Kong, New Territories 999077, China
Department of Electronics and Computer Engineering
The Hong Kong University of Science and Technology
-
Affiliation as printed
Department of Electrical and Computer Engineering
University of Massachusetts
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Chinese University of Hong Kong
Affiliation as printed
Department of Electronic Engineering
The Chinese University of Hong Kong
-
Affiliation as printed
Forschungszentrum Jülich GmbH
Peter Grünberg Institute 14
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Peking University · Key Laboratory of Guangdong Province · Nanjing University
Affiliation as printed
Guangdong Provincial Key Laboratory of In-Memory Computing Chips, School of Electronic and Computer Engineering, Shenzhen Graduate School
Institute of Brain-Inspired Intelligence, State Key Laboratory for Novel Software Technology, School of Intelligence Science and Technology
Nanjing University
Peking University
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits
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Peking University · Key Laboratory of Guangdong Province · Nanjing University
Affiliation as printed
Guangdong Provincial Key Laboratory of In-Memory Computing Chips, School of Electronic and Computer Engineering, Shenzhen Graduate School
Institute of Brain-Inspired Intelligence, State Key Laboratory for Novel Software Technology, School of Intelligence Science and Technology
Nanjing University
Peking University
School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits
-
Affiliation as printed
Center for Alloy Innovation and Design, State Key Laboratory for Mechanical Behavior of Materials
Xi’an Jiaotong University
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Chai Yang corresponding
Hong Kong Polytechnic University
Affiliation as printed
Department of Applied Physics
Joint Research Centre of Microelectronics
Research Institute for Artificial Intelligence of Things
The Hong Kong Polytechnic University
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