November 24, 2025 review Future interconnect materials for highly integrated semiconductor devices Nature Reviews Electrical Engineering DOI: 10.1038/s44287-025-00233-y OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 10 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access 2D materials for future heterogeneous electronics 2022 Nature Communications article Materials Science Graphene research and applications Open access cited by 1 patent 577 citations 1 result