Material Composition Trends in Printed Circuit Boards of Mobile Phones

SSRN Electronic Journal

Authors 9

1. Aleksander Jandric corresponding
2. Lukas Ginzinger
3. Dzeneta Vrucak Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University

   RWTH Aachen University, Templergraben 55, 52056 Aachen, 52056, Germany

4. Damien Latacz Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University

   RWTH Aachen University, Templergraben 55, 52056 Aachen, 52056, Germany

5. Tim Gießmann Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University

   RWTH Aachen University, Templergraben 55, 52056 Aachen, 52056, Germany

6. Ricardo Gabbay de Souza

   Technical University of Denmark

   Affiliation as printed

   Technical University of Denmark

   Technical University of Denmark, Anker Engelunds Vej 1, Building 101A, Lyngby, 2800, Denmark

7. Cledwyn Tawanda Mangunda

   University of Cape Town

   Affiliation as printed

   University of Cape Town (UCT)

   University of Cape Town (UCT), Cape Town, South Africa

8. Alexander Birich Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University

   RWTH Aachen University, Templergraben 55, 52056 Aachen, 52056, Germany

9. Stefan Petrus Salhofer