January 09, 2025 article Study on the Ultrasonic Bonding Process Using Molecular Dynamics Simulation Journal of Electronic Materials DOI: 10.1007/s11664-024-11712-7 OpenAlex Authors 0 Author list not loaded yet. Cited by 0 stored of 2 References 1 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Molecular dynamics simulation of interface atomic diffusion in ultrasonic metal welding 2021 The International Journal of Advanced Manufacturing Technology article Engineering Advanced Welding Techniques Analysis Open access 22 citations 1 result