Entropy engineering enabled atomically dispersed Cu doping leading to an exceptionally high thermoelectric figure of merit in n-type lead chalcogenides
Energy & Environmental Science, vol. 17, pp. 2921–2934
Abstract
Entropy engineering fully dissolved extra Cu atoms into the interstitial lattice sites of lead chalcogenides, yielding high charge carrier mobility and ZT values in a wide temperature range.
Authors 17
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Chinese Academy of Sciences · China Spallation Neutron Source · Institute of High Energy Physics
Affiliation as printed
Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China
Spallation Neutron Source Science Center, Dongguan 523803, China
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Kunming University of Science and Technology
Affiliation as printed
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Northwestern Polytechnical University · Chinese Academy of Sciences · Shanghai Institute of Microsystem and Information Technology · State Key Laboratory of Functional Materials for Informatics · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, 200050 Shanghai, China
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Affiliation as printed
Laboratory of High-Pressure Physics and Material Science (HPPMS), School of Physics and Physical Engineering, Qufu Normal University, Qufu, 273165, China
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Affiliation as printed
Laboratory of High-Pressure Physics and Material Science (HPPMS), School of Physics and Physical Engineering, Qufu Normal University, Qufu, 273165, China
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Affiliation as printed
Laboratory of High-Pressure Physics and Material Science (HPPMS), School of Physics and Physical Engineering, Qufu Normal University, Qufu, 273165, China
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Affiliation as printed
Institute of Physics (IA), RWTH Aachen University, 52056 Aachen, Germany
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Northwestern Polytechnical University · Chinese Academy of Sciences · Shanghai Institute of Microsystem and Information Technology · State Key Laboratory of Functional Materials for Informatics · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, 200050 Shanghai, China
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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Chao Li corresponding
China Electronic Product Reliability and Environmental Test Institute · Ministry of Industry and Information Technology
Affiliation as printed
The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, Guangzhou 510006, China
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Affiliation as printed
Institute of Physics (IA), RWTH Aachen University, 52056 Aachen, Germany
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Chongjian Zhou corresponding
Northwestern Polytechnical University · State Key Laboratory of Solidification Processing · Ministry of Industry and Information Technology
Affiliation as printed
State Key Laboratory of Solidification Processing, and Key Laboratory of Radiation Detection Materials and Devices, Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an 710072, China
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