Flexible CMOS electronics based on 2D p-type WSe2 and n-type MoS2

Abstract

Flexible electronics have been emerging in the last years for a wide variety of applications. In this scenario, transition metal dichalcogenides (TMDCs), such as molybdenum disulfide (MOS2) and tungsten diselenide (WSe2), have captured increased attention because of their complementary transport properties, and their excellent mechanical flexibility [1]. In particular, MOS2has shown good electron transport, while WSe2has predominantly shown hole transport [2]. This enables complementary metal-oxide semiconductor (CMOS) technology with its inherent advantages over its unipolar counterpart, i.e., low power dissipation and large noise immunity. Here, we demonstrate n-type MOS2and p-type WSe2field effect transistors (FETs) and combine them to form CMOS inverters on a flexible polyimide (PI) substrate.

Authors 10

1. Agata Piacentini Aachen Advanced Microelectronic Center Aachen

   RWTH Aachen University · AMO (Germany)

   Affiliation as printed

   Advanced Microelectronic Center Aachen (AMICA), AMO GmbH,Aachen,Germany,52074

   RWTH Aachen University, Aachen, Germany

2. Dmitry K. Polyushkin

   TU Wien

   Affiliation as printed

   TU Wien,Vienna,Austria,1040

3. Burkay Uzlu Aachen Advanced Microelectronic Center Aachen

   AMO (Germany)

   Affiliation as printed

   Advanced Microelectronic Center Aachen (AMICA), AMO GmbH,Aachen,Germany,52074

4. Annika Grundmann Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Aachen,Germany,52074

5. M. Heuken Aachen

   RWTH Aachen University · Aixtron (Germany)

   Affiliation as printed

   RWTH Aachen University,Aachen,Germany,52074

   AIXTRON SE, Herzogenrath, Germany

6. H. Kalisch Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Aachen,Germany,52074

7. Andrei Vescan Aachen

   RWTH Aachen University

   Affiliation as printed

   RWTH Aachen University,Aachen,Germany,52074

8. Thomas Mueller

   TU Wien

   Affiliation as printed

   TU Wien,Vienna,Austria,1040

9. Max C. Lemme Aachen Advanced Microelectronic Center Aachen

   RWTH Aachen University · AMO (Germany)

   Affiliation as printed

   Advanced Microelectronic Center Aachen (AMICA), AMO GmbH,Aachen,Germany,52074

   RWTH Aachen University, Aachen, Germany

10. Daniel Neumaier Aachen Advanced Microelectronic Center Aachen

    AMO (Germany)

    Affiliation as printed

    Advanced Microelectronic Center Aachen (AMICA), AMO GmbH,Aachen,Germany,52074