SPEChpc 2021 Benchmark Suites for Modern HPC Systems

ACM/SPEC International Conference on Performance Engineering (ICPE), pp. 15–16

Abstract

The SPEChpc 2021 suites are application-based benchmarks de- signed to measure performance of modern HPC systems. The bench- marks support MPI, MPI+OpenMP, MPI+OpenMP target offload, MPI+OpenACC and are portable across all major HPC platforms.

Authors 33

1. Junjie Li
   Affiliation as printed

   TACC, Austin, TX, USA

2. Alexander Bobyr

   Intel (United States)

   Affiliation as printed

   Intel, Nizhny Novgorod, Russian Fed

3. Swen Boehm

   Oak Ridge National Laboratory

   Affiliation as printed

   ORNL, Oak Ridge, TN, USA

4. William C. Brantley

   Advanced Micro Devices (United States)

   Affiliation as printed

   AMD, Austin, TX, USA

5. Holger Brunst

   Technische Universität Dresden

   Affiliation as printed

   TU Dresden, Dresden, Germany

6. Aurélien Cavelan

   University of Basel

   Affiliation as printed

   U of Basel, Basel, Switzerland

7. Sunita Chandrasekaran

   University of Delaware

   Affiliation as printed

   U of Delaware, Newark, DE, USA

8. Jimmy Cheng
   Affiliation as printed

   Lenovo, Morrisville, NC, USA

9. Florina M. Ciorba

   University of Basel

   Affiliation as printed

   U of Basel, Basel, Switzerland

10. Mathew Colgrove

    Nvidia (United States)

    Affiliation as printed

    NVIDIA, Hillsboro, OR, USA

11. Tony Curtis

    Stony Brook University

    Affiliation as printed

    Stony Brook U, New York, NY, USA

12. Christopher S. Daley

    Lawrence Berkeley National Laboratory

    Affiliation as printed

    LBNL, Berkeley, CA, USA

13. Mauricio Ferrato

    University of Delaware

    Affiliation as printed

    U of Delaware, Newark, DE, USA

14. Mayara Gimenes de Souza

    University of Delaware

    Affiliation as printed

    U of Delaware, Newark, DE, USA

15. Nick Hagerty

    Oak Ridge National Laboratory

    Affiliation as printed

    ORNL, Oak Ridge, TN, USA

16. Robert Henschel

    Indiana University Bloomington · Indiana University

    Affiliation as printed

    Indiana U, Bloomington, IN, USA

17. Guido Juckeland

    Helmholtz-Zentrum Dresden-Rossendorf

    Affiliation as printed

    HZDR, Dresden, Germany

18. Jeffrey Kelling

    Helmholtz-Zentrum Dresden-Rossendorf

    Affiliation as printed

    HZDR, Dresden, Germany

19. Kelvin Li

    IBM (Canada)

    Affiliation as printed

    IBM, Toronto, Canada

20. Ron Lieberman

    Advanced Micro Devices (United States)

    Affiliation as printed

    AMD, Austin, TX, USA

21. Egor Melnichenko

    Intel (United States)

    Affiliation as printed

    Intel, Nizhny Novgorod, Russian Fed

22. Mohamed Ayoub Neggaz

    University of Basel

    Affiliation as printed

    U of Basel, Basel, Switzerland

23. Hiroshi Ono
    Affiliation as printed

    HPE, Houston, TX, USA

24. Carl G. Ponder

    Nvidia (United States)

    Affiliation as printed

    NVIDIA, Austin, TX, USA

25. Dave Raddatz
    Affiliation as printed

    HPE, Austin, TX, USA

26. Severin Schueller Aachen

    RWTH Aachen University

    Affiliation as printed

    RWTH Aachen U, Aachen, Germany

27. Robert Searles

    University of Delaware

    Affiliation as printed

    U of Delaware, Newark, DE, USA

28. Fedor Vasilev

    Intel (United States)

    Affiliation as printed

    Intel, Nizhny Novgorod, Russian Fed

29. Veronica Melesse Vergara

    Oak Ridge National Laboratory

    Affiliation as printed

    ORNL, Oak Ridge, TN, USA

30. Bo Wang Aachen

    RWTH Aachen University

    Affiliation as printed

    RWTH Aachen U, Aachen, Germany

31. Bert Wesarg

    Technische Universität Dresden

    Affiliation as printed

    TU Dresden, Dresden, Germany

32. Sandra Wienke Aachen

    RWTH Aachen University

    Affiliation as printed

    RWTH Aachen U, Aachen, Germany

33. Miguel Zavala

    University of Delaware

    Affiliation as printed

    U of Delaware, Newark, DE, USA