October 20, 2017 article Dynamic DSC curing kinetics and thermogravimetric study of epoxy resin of 9,9′-bis(4-hydroxyphenyl)anthrone-10 Journal of Thermal Analysis and Calorimetry DOI: 10.1007/s10973-017-6761-y OpenAlex Authors 0 Author list not loaded yet. Cited by 3 stored of 53 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Factory simulation of adhesive bonding processes considering pot-life-induced waste 2026 Journal of Advanced Joining Processes article Decision Sciences Simulation Techniques and Applications Open access 0 citations Inductive Curing of 2C Epoxy Adhesives in Foil to Foil Specimens 2024 Proceedings in engineering mechanics conference-paper Engineering Epoxy Resin Curing Processes 1 citations Curing of epoxy adhesives between thin metal foils by means of inductive heating 2024 Proceedings of the Institution of Mechanical Engineers Part L Journal of Materials Design and Applications article Engineering Epoxy Resin Curing Processes 3 citations 3 results References 0