May 10, 2017 article Heat Transfer Characteristics of Billet/Die Interface and Measures to Relieve Thermal Stress for Hot Forging Die International Journal of Thermophysics DOI: 10.1007/s10765-017-2242-6 OpenAlex Authors 0 Author list not loaded yet. Cited by 1 stored of 18 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Limits to making L-shape ring profiles without ring growth 2021 Journal of Materials Processing Technology article Engineering Metal Forming Simulation Techniques Open access 22 citations 1 result References 0