July 01, 2001 article Interface evolution and bond strength when diffusion bonding materials with stable oxide films Surface and Interface Analysis DOI: 10.1002/sia.1088 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 123 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints 2020 Metals article Engineering Advanced Welding Techniques Analysis Open access cited by 1 patent 91 citations A nonlocal method for modeling interfaces: Numerical simulation of decohesion and sliding at grain boundaries 2020 Computer Methods in Applied Mechanics and Engineering article Engineering Numerical methods in engineering 20 citations 2 results References 0