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May 01, 2014 conference-paper

Effective testing for wafer reject minimization by terahertz analysis and sub-surface imaging

Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc.2014.6847013 OpenAlex

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A novel scattering-type THz microprobe with integrated source and detector for contact-free, high-speed surface imaging at sub-μm-resolution
2023 International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) conference-paper Engineering Terahertz technology and applications

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