August 18, 2006 article Nickel layer deposition on SiC nanoparticles by simple electroless plating and its dielectric behaviors Powder Technology DOI: 10.1016/j.powtec.2006.07.002 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 94 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Development of a Novel Processing Route for Dispersoid/Precipitation‐Strengthened High Conductive Copper Alloys by Using Metalized Nanoceramics in Additive Manufacturing 2024 Advanced Engineering Materials article Engineering Additive Manufacturing Materials and Processes Open access 3 citations Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles 2024 Advanced Engineering Materials article Engineering Electrodeposition and Electroless Coatings Open access 2 citations 2 results References 0