December 03, 2008 article Interfacial evolution behavior and reliability evaluation of CoSb3/Ti/Mo–Cu thermoelectric joints during accelerated thermal aging Journal of Alloys and Compounds DOI: 10.1016/j.jallcom.2008.10.037 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 97 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Thermoelectric interface materials for reliable power generation 2025 Materials Today article Materials Science Advanced Thermoelectric Materials and Devices 19 citations Screening strategy for developing thermoelectric interface materials 2023 Science article Materials Science Advanced Thermoelectric Materials and Devices 253 citations 2 results References 0