May 07, 2011 article Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al–Cu–Ag eutectic alloy Current Applied Physics DOI: 10.1016/j.cap.2011.04.018 OpenAlex Authors 0 Author list not loaded yet. Cited by 2 stored of 28 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Impact of crystal orientation relationship on microstructure evolution in Al-Ag-Cu ternary eutectic 2022 Journal of Crystal Growth article Materials Science Solidification and crystal growth phenomena Open access 4 citations Microstructure Evolution and Grain Growth Competition in Directionally Solidified Ternary Al–Ag2Al–Al2Cu Eutectic 2022 Metallurgical and Materials Transactions A article Materials Science Solidification and crystal growth phenomena 5 citations 2 results References 0