July 22, 2015 article A thermal modeling methodology for power semiconductor modules Microelectronics Reliability DOI: 10.1016/j.microrel.2015.06.102 OpenAlex Authors 0 Author list not loaded yet. Cited by 9 stored of 34 Search Sort Most cited Newest Oldest Patent citations Title Any typearticle review book-chapter conference-paper preprint dissertation book dataset other Any fieldAgricultural and Biological Sciences Arts and Humanities Biochemistry, Genetics and Molecular Biology Business, Management and Accounting Chemical Engineering Chemistry Computer Science Decision Sciences Dentistry Earth and Planetary Sciences Economics, Econometrics and Finance Energy Engineering Environmental Science Health Professions Immunology and Microbiology Materials Science Mathematics Medicine Neuroscience Nursing Pharmacology, Toxicology and Pharmaceutics Physics and Astronomy Psychology Social Sciences Veterinary Open access Diagnosing Thermal-Interface Aging of Power Devices Using Self-Sensing 2024 IEEE Transactions on Power Electronics article Engineering Silicon Carbide Semiconductor Technologies 4 citations Optimization of Temperature Sensor Placement in Multi-Chip Power Modules Using Frequency Domain Analysis 2023 European Conference on Power Electronics and Applications conference-paper Engineering Silicon Carbide Semiconductor Technologies 0 citations Intelligent Monitoring and Maintenance Technology for Next-Generation Power Electronic Systems 2021 IEEE Journal of Emerging and Selected Topics in Power Electronics article Engineering Reliability and Maintenance Optimization cited by 3 patents 21 citations Increasing Torque Capability of AC Drives via Active Thermal Management of Inverters 2021 IEEE Transactions on Industry Applications article Engineering Silicon Carbide Semiconductor Technologies 16 citations Reviewing Thermal-Monitoring Techniques for Smart Power Modules 2021 IEEE Journal of Emerging and Selected Topics in Power Electronics article Engineering Silicon Carbide Semiconductor Technologies cited by 1 patent 78 citations Active Thermal Management for Enhancing Peak-Current Capability of Three-Phase Inverters 2020 IEEE Energy Conversion Congress and Exposition (ECCE) conference-paper Engineering Silicon Carbide Semiconductor Technologies 16 citations Enhancing Lifetime of Power Electronic Modules via Thermal Buffers 2020 IEEE Energy Conversion Congress and Exposition (ECCE) conference-paper Engineering Silicon Carbide Semiconductor Technologies 9 citations Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules 2020 IEEE Transactions on Industry Applications article Engineering Silicon Carbide Semiconductor Technologies 49 citations Semiconductor Temperature and Condition Monitoring Using Gate-Driver-Integrated Inverter Output Voltage Measurement 2020 IEEE Transactions on Industry Applications article Engineering Silicon Carbide Semiconductor Technologies 15 citations 9 results References 0